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1

Electroless Deposition of Copper on Organic and Inorganic Substrates Using a Sn∕Ag Catalyst

Fritz, Nathan, Koo, Hyo-Chol, Wilson, Zachary, Uzunlar, Erdal, Wen, Zhongsheng, Yeow, Xinyi, Bidstrup Allen, Sue Ann, Kohl, Paul A.

Journal:

Journal of The Electrochemical Society

Year:

2012

Language:

english

File:

PDF, 181 KB

english, 2012

2

Affect of Anneal Temperature on All-Copper Flip-Chip Connections Formed via Electroless Copper Deposition

Hyo-Chol Koo, Lightsey, C., Kohl, P.A.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 814 KB

english, 2012

3

Low-resistivity Cu film electrodeposited with 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonate for the application to the interconnection of electronic devices

Sung Ki Cho, Myung Jun Kim, Hyo-Chol Koo, Oh Joong Kwon, Jae Jeong Kim

Journal:

Thin Solid Films

Year:

2012

Language:

english

File:

PDF, 706 KB

english, 2012

4

Pulse Electrodeposition for Improving Electrical Properties of Cu Thin Film

Kim, Myung Jun, Cho, Sung Ki, Koo, Hyo-Chol, Lim, Taeho, Park, Kyung Ju, Kim, Jae Jeong

Journal:

Journal of The Electrochemical Society

Year:

2010

Language:

english

File:

PDF, 258 KB

english, 2010

5

Effects of Stabilizing Agents on Film Properties in Ag Electroless Plating

Koo, Hyo-Chol, Kim, Jae Jeong

Journal:

Journal of The Electrochemical Society

Year:

2008

Language:

english

File:

PDF, 410 KB

english, 2008

6

Characterization and Cu electroless plating of laser-drilled through-wafer via-holes in GaN/Al2O3

Jaehui Ahn, Hong-Yeol Kim, Hyo-Chol Koo, Jae Jeong Kim, Jihyun Kim

Journal:

Thin Solid Films

Year:

2009

Language:

english

File:

PDF, 874 KB

english, 2009

7

Thin film silver deposition by electroplating for ULSI interconnect applications

Joon-Mo Seo, Sung Ki Cho, Hyo-Chol Koo, Soo-Kil Kim, Oh Joong Kwon, Jae Jeong Kim

Journal:

Korean Journal of Chemical Engineering

Year:

2009

Language:

english

File:

PDF, 605 KB

english, 2009

8

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Compliant, copper based chip to substrate connections

Koo, Hyo-Chol, Lightsey, C. Hunter, An, Ping, Kohl, Paul A.

Year:

2010

Language:

english

File:

PDF, 1.52 MB

english, 2010

9

Investigation of Cu growth phenomena on Ru substrate during electroless deposition using hydrazine as a reducing agent

Kim, Kwang Hwan, Lim, Taeho, Park, Kyung Ju, Koo, Hyo-Chol, Kim, Myung Jun, Kim, Jae Jeong

Journal:

Electrochimica Acta

Year:

2015

Language:

english

File:

PDF, 2.11 MB

english, 2015

10

Room-Temperature Electroless Deposition of CoB Film and its Application as In Situ Capping during Buffing Process

Lim, Taeho, Koo, Hyo-Chol, Kim, Kwang Hwan, Park, Kyung Ju, Kim, Myung Jun, Kwon, Oh Joong, Kim, Jae Jeong

Journal:

Electrochemical and Solid-State Letters

Year:

2011

Language:

english

File:

PDF, 778 KB

english, 2011

11

Conformal Cu Seed Layer Formation by Electroless Deposition in Non-Bosch through Silicon Vias

Park, Kyung Ju, Kim, Myung Jun, Lim, Taeho, Koo, Hyo-Chol, Kim, Jae Jeong

Journal:

Electrochemical and Solid-State Letters

Year:

2012

Language:

english

File:

PDF, 239 KB

english, 2012

12

Copper Electroless Bonding of Dome-Shaped Pillars for Chip-to-Package Interconnect

Koo, Hyo-Chol, Saha, Rajarshi, Kohl, Paul A.

Journal:

Journal of The Electrochemical Society

Year:

2011

Language:

english

File:

PDF, 439 KB

english, 2011

13

Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing

Kang, Min Cheol, Kim, Yung Jun, Koo, Hyo-Chol, Cho, Sung Ki, Kim, Jae Jeong

Journal:

Electrochemical and Solid-State Letters

Year:

2009

Language:

english

File:

PDF, 341 KB

english, 2009

14

The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating

Cha, Seung Hwan, Koo, Hyo-Chol, Kim, Jae Jeong

Journal:

Journal of The Electrochemical Society

Year:

2005

Language:

english

File:

PDF, 509 KB

english, 2005

15

ECS Transactions [ECS 216th ECS Meeting - Vienna, Austria (October 4 - October 9, 2009)] - Evaluation of Stability and Reactivity of Solutions by In Situ Transmittance in Electroless Deposition

Park, Kyung Ju, Koo, Hyo-Chol, Lim, Taeho, Kim, Jae Jeong

Year:

2010

Language:

english

File:

PDF, 3.52 MB

english, 2010

16

Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection

Koo, Hyo-Chol, Kim, Seo Young, Cho, Sung Ki, Kim, Jae Jeong

Journal:

Journal of The Electrochemical Society

Year:

2008

Language:

english

File:

PDF, 641 KB

english, 2008

17

Direct-Electroplating of Ag on Pretreated TiN Surfaces

Koo, Hyo-Chol, Ahn, Eung Jin, Kim, Jae Jeong

Journal:

Journal of The Electrochemical Society

Year:

2008

Language:

english

File:

PDF, 451 KB

english, 2008

18

Two-Step Filling in Cu Electroless Deposition Using a Concentration-Dependent Effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic Acid

Lee, Chang Hwa, Kim, Ae Rim, Kim, Soo-Kil, Koo, Hyo-Chol, Cho, Sung Ki, Kim, Jae Jeong

Journal:

Electrochemical and Solid-State Letters

Year:

2008

Language:

english

File:

PDF, 511 KB

english, 2008

19

Silver Direct Electrodeposition on Ru Thin Films

Koo, Hyo-Chol, Cho, Sung Ki, Lee, Chang Hwa, Kim, Soo-Kil, Kwon, Oh Joong, Kim, Jae Jeong

Journal:

Journal of The Electrochemical Society

Year:

2008

Language:

english

File:

PDF, 1.05 MB

english, 2008

20

[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Optimization of Pd Activation on Ta Substrate for Cu Electroless Deposition Using Electrochemical Method

Lim, Taeho, Koo, Hyo-Chol, Kim, Jae Jeong

Year:

2009

Language:

english

File:

PDF, 1005 KB

english, 2009

21

Electroless Copper Bonding with Local Suppression for Void-Free Chip-to-Package Connections

Koo, Hyo-Chol, Saha, Rajarshi, Kohl, Paul A.

Journal:

Journal of The Electrochemical Society

Year:

2012

Language:

english

File:

PDF, 160 KB

english, 2012

22

[ECS 209th ECS Meeting - Denver, Colorado (May 7-May 12, 2006)] ECS Transactions - Electroless Deposition of Cu and Ag For ULSI Interconnect Fabrication

Kim, Jae Jeong, Lee, Chang Hwa, Kim, Ae Rim, Kim, Seo Young, Kim, Sangchul, Koo, Hyo-Chol

Year:

2007

Language:

english

File:

PDF, 1.33 MB

english, 2007

23

Evaluation of Stability and Reactivity of Cu Electroless Deposition Solution by In-Situ Transmittance Measurement

Park, Kyung Ju, Koo, Hyo-Chol, Lim, Taeho, Kim, Myung Jun, Kwon, Oh Joong, Kim, Jae Jeong

Journal:

Journal of The Electrochemical Society

Year:

2011

Language:

english

File:

PDF, 1.23 MB

english, 2011

24

Effect of 2-Mercapto-5-benzimidazolesulfonic Acid in Superconformal Cu Electroless Deposition

Lee, Chang Hwa, Kim, Ae Rim, Koo, Hyo-Chol, Kim, Jae Jeong

Journal:

Journal of The Electrochemical Society

Year:

2009

Language:

english

File:

PDF, 201 KB

english, 2009

25

Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process

Koo, Hyo-Chol, Cho, Sung Ki, Kwon, Oh Joong, Suh, Myung-Won, Im, Young, Kim, Jae Jeong

Journal:

Journal of The Electrochemical Society

Year:

2009

Language:

english

File:

PDF, 547 KB

english, 2009

26

Electroless Gold Plating on Aluminum Patterned Chips for CMOS-Based Sensor Applications

Ko, Jung Woo, Koo, Hyo Chol, Kim, Dong Wan, Seo, Sung Min, Kang, Tae June, Kwon, Yongjoo, Yoon, Jung Lim, Cheon, Jun Ho, Kim, Yong Hyup, Kim, Jae Jeong, Park, Young June

Journal:

Journal of The Electrochemical Society

Year:

2010

Language:

english

File:

PDF, 474 KB

english, 2010

27

[ECS 209th ECS Meeting - Denver, Colorado (May 7-May 12, 2006)] ECS Transactions - Silver Direct Electrodeposition on Ru Thin Film

Koo, Hyo-Chol, Kim, Jae Jeong, Kim, Keeho

Year:

2007

Language:

english

File:

PDF, 1.17 MB

english, 2007

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